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==2024.10.03: PCB changes==
We would like to inform you that starting from January, 2025, there will be changes in the PCB's modification of our FMM130 devices. These changes affect FMM130, FMM230 and FMM125 devices.
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change description
|-
| style="text-align: left; background: white;" |Change type
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
|-
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
#Replaced the LIS3DH accelerometer on the bottom layer with an LIS2DH12 on a neighbouring footprint. Additionally, the accompanying capacitors and resistors were replaced.
#The top layer remains unchanged.
|-
| style="text-align: left; background: white;" |Old Version: <br> [[File:png.|center|250px]] [[File:png.|center|250px]]
| style="text-align: left; background: white;" |New Version: <br> [[File:png.|250px]] [[File:png.|center|250px]]
|-
| style="text-align: left; background: white;" |Change reasons
| colspan="2" style="text-align: left; background: white;" |
#The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
|-
| style="text-align: left; background: white;" | Product release date
| colspan="2" style="text-align: left; background: white;" |January, 2025
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Affected products
|-
| style="width: 221px; text-align: left; background: white;" |Model
| style="width: 448px; text-align: left; background: white;" |Affected order codes: '''FMM130'''******* order codes
| style="width: 448px; text-align: left; background: white;" |Affected order codes: '''FMM130'''******* order codes
|-
| style="text-align: left; background: white;" |'''FMM130'''
| style="text-align: left; background: white;" |PCB's mechanical part changes
| style="text-align: left; background: white;" |PCB's mechanical part changes
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change impact
|-
| style="width: 221px; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change.
|-
| style="text-align: left; background: white;" |Suggested implementation plan
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
|-
|}
{| class="wikitable"
|+
! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
|-
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
|-
|}
==2024.07.29: PCB changes==
==2024.07.29: PCB changes==
