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| | | product_name = FMB230 tracking device | | | product_name = FMB230 tracking device |
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| − |
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| − | __TOC__
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| − |
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| − | ==2024.10.03: PCB changes==
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| − | We would like to inform you that starting from January, 2025, there will be changes in the PCB's modification of our FMB230 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Mechanical part changes
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
| |
| − | #Replaced the LIS3DH accelerometer on the top layer with an LIS2DH12 on a neighbouring footprint. Additionally, the accompanying capacitors and resistors were replaced.
| |
| − | #The bottom layer remains unchanged.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Old Version: <br> [[File:PCBOLD3_FMM130_2024.10.04.png|center|250px]] [[File:PCBOLD4_FMM130_2024.10.04.png|center|250px]]
| |
| − | | style="text-align: left; background: white;" |New Version: <br> [[File:PCBNEW3_FMM130_2024.10.04.png|center|250px]] [[File:PCBNEW4_FMM130_2024.10.04.png|center|250px]]
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change reasons
| |
| − | | colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
| |
| − | |-
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| − | | style="text-align: left; background: white;" | Product release date
| |
| − | | colspan="2" style="text-align: left; background: white;" |January, 2025
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" |Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
| |
| − | | style="text-align: left; background: white;" |FMB230******* order codes
| |
| − | | style="text-align: left; background: white;" |PCB's mechanical part changes
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
| |
| − | |-
| |
| − | | colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | ==2024.05.24: PCB changes==
| |
| − | We would like to inform you that starting from July, 2024, there will be changes in the PCB's modification of our FMB230 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Mechanical part changes
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
| |
| − | #Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
| |
| − | #Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
| |
| − | #Accelerometer LIS2DH12 was moved to top layer and closer to existing LIS3DH accelerometer.
| |
| − | #Positioning hole was moved from LTE to BLE antenna.
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| − | #Components from GNSS antenna feed point were moved away to comply with manufacturing requirements.
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| − | #Main fuse moved to TOP layer.
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| − | #Added 1 positioning hole close to GNSS antenna.
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| − | #Positioning hole near LED's was removed.
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| − | |-
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| − | | style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]
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| − | | style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
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| − | |-
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| − | | style="text-align: left; background: white;" |Change reasons
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| − | | colspan="2" style="text-align: left; background: white;" |
| |
| − | The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" | Product release date
| |
| − | | colspan="2" style="text-align: left; background: white;" |2024 July
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| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
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| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" |Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
| |
| − | | style="text-align: left; background: white;" |FMB230******* order codes
| |
| − | | style="text-align: left; background: white;" |New firmware version
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" |If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | ==2024.05.13: Base firmware update==
| |
| − | We would like to inform you about the base firmware update for FMB230 starting from June, 2024. New production firmware version will be '''03.29.00.Rev.18'''
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Firmware update
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Key improvements from last production firmware are listed in errata: [[FMB230 firmware errata]]
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Old version: <br> 03.29.00.Rev.13
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| − | | style="text-align: left; background: white;" |New version: <br> 03.29.00.Rev.18
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| − | |-
| |
| − | | style="text-align: left; background: white;" |Change reasons
| |
| − | | colspan="2" style="text-align: left; background: white;" |FMB230 base firmware version update
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| − | |-
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| − | | style="text-align: left; background: white;" | Product release date
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| − | | colspan="2" style="text-align: left; background: white;" |2024 June
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| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
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| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" |Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
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| − | | style="text-align: left; background: white;" |Order codes with base Firmware
| |
| − | | style="text-align: left; background: white;" |New firmware version
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" |If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − |
| |
| − | ==2024.01.22: Modified battery placement within the casing==
| |
| − | We would like to inform you that starting from January 2024, there will be a small change in the FMB230 devices casing.We have adjusted the battery placement and increased PCB guide height within casing. This modification was essential to enhance our manufacturing process.
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Optimizing robotic battery placement process within casing
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |The modifications will not impact the place of the battery or PCB within the FMB230 device.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Old Version: [[File:FMX - OLD.jpg|center|250px]]
| |
| − | | style="text-align: left; background: white;" |New Version: [[File:FMX - NEW.jpg|center|250px]] [[File:FMX - NEW 2.jpg|center|250px]]
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change reasons
| |
| − | | colspan="2" style="text-align: left; background: white;" |
| |
| − | # Modified battery placement within the casing.
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| − | # PCB guide height increased for easier assembly.
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| − | # Improved manufacturing process.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Product release date
| |
| − | | colspan="2" style="text-align: left; background: white;" |January, 2024
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" |Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
| |
| − | | style="text-align: left; background: white;" |FMB230 all codes
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| − | | style="text-align: left; background: white;" | Modified battery placement and PCB guide height within the casing.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |During transition period clients might receive devices with previous casing design. The transition period can last from January to February inclusive.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" |No implementation plan is needed.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
| |
| − | |-
| |
| − | | colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
| |
| − | |}
| |
| − |
| |
| − | ==2023.11.27: Modifications of PCB shape ==
| |
| − |
| |
| − | We would like to inform you, that shape of the PCB (Printed Circuit Board) for the FMB110, FMB120, FMB130, and FMB230 devices will be altered as part of an upcoming factory update from November, 2023.
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Internal
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Old Version: [[File:51 TOP OLD.png|center|250px]] [[File:51 BOT OLD.png|center|250px]]
| |
| − | | style="text-align: left; background: white;" |New Version: [[File:64 TOP NEW.png|center|250px]] [[File:64 BOT NEW.png|center|250px]]
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| − | |-
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| − | | style="text-align: left; background: white;" |Change reasons
| |
| − | | colspan="2" style="text-align: left; background: white;" |
| |
| − | #The cutout has been removed as it is intended only for devices with an external antenna.
| |
| − | #Replaced electrolytic capacitors with ceramic capacitors in order to increase manufacturing efficiency. The modifications made do not have any impact on the functionality of the devices.
| |
| − | |-
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Product release date
| |
| − | | colspan="2" style="text-align: left; background: white;" |November, 2023
| |
| − | |-
| |
| − | |}
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" |Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
| |
| − | | style="text-align: left; background: white;" |FMB230 all codes
| |
| − | | style="text-align: left; background: white;" |
| |
| − | #PCB cutout intended for an external antenna has been removed.
| |
| − | #Replaced electrolytic capacitors with ceramic capacitors.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
| |
| − | |-
| |
| − | | colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
| |
| − | |}
| |
| − |
| |
| − | ==2022.09.12: Base firmware update==
| |
| − | We would like to inform you about the base firmware update for FMB230 starting from October 1st, 2022. New production firmware version will be 03.27.13.Rev.03
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change description
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change type
| |
| − | | colspan="2" style="text-align: left; background: white;" |Firmware update
| |
| − | |-
| |
| − | | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Key improvements from last production firmware are listed in errata: https://wiki.teltonika-gps.com/view/FMB230_firmware_errata
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Old version: <br> FMB230 03.27.12.Rev.00
| |
| − | | style="text-align: left; background: white;" |New version: <br> FMB230 03.27.13.Rev.03
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Change reasons
| |
| − | | colspan="2" style="text-align: left; background: white;" |FMB230 base firmware version update
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" | Product release date
| |
| − | | colspan="2" style="text-align: left; background: white;" |2022 October
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| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Affected products
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Model
| |
| − | | style="width: 448px; text-align: left; background: white;" |Affected order codes
| |
| − | | style="width: 448px; text-align: left; background: white;" | Order code changes
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |FMB230
| |
| − | | style="text-align: left; background: white;" |FMB230******* order codes with base Firmware
| |
| − | | style="text-align: left; background: white;" |Update firmware
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| − | {| class="wikitable"
| |
| − | |+
| |
| − | ! colspan="3" style="text-align: left; background: white;" |Change impact
| |
| − | |-
| |
| − | | style="width: 221px; text-align: left; background: white;" |Risk assessment
| |
| − | | colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
| |
| − | |-
| |
| − | | style="text-align: left; background: white;" |Suggested implementation plan
| |
| − | | colspan="2" style="text-align: left; background: white;" | If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
| |
| − | |-
| |
| − | |}
| |
| − |
| |
| | [[Category:FMB230]] | | [[Category:FMB230]] |
