Difference between revisions of "FMB230 Product Change Notifications"

From Wiki Knowledge Base | Teltonika GPS
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__TOC__
 
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==2024.10.03: PCB changes==
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==2024.05.24: PCB changes==
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We would like to inform you that starting from January, 2025, there will be changes in the PCB's modification of our FMB230 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
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We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMB110 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
 
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|-
 
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| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
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| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
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| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
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#Replaced the LIS3DH accelerometer on the top layer with an LIS2DH12 on a neighbouring footprint. Additionally, the accompanying capacitors and resistors were replaced.
 
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#The bottom layer remains unchanged.
 
 
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| style="text-align: left; background: white;" |Old Version: <br>  [[File:PCBOLD3_FMM130_2024.10.04.png|center|250px]] [[File:PCBOLD4_FMM130_2024.10.04.png|center|250px]]
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| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]                                                          
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| style="text-align: left; background: white;" |New Version: <br>  [[File:PCBNEW3_FMM130_2024.10.04.png|center|250px]] [[File:PCBNEW4_FMM130_2024.10.04.png|center|250px]]
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| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
 
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|-
 
| style="text-align: left; background: white;" |Change reasons
 
| style="text-align: left; background: white;" |Change reasons
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| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
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| colspan="2" style="text-align: left; background: white;" |
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| style="text-align: left; background: white;" | Product release date
 
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| colspan="2" style="text-align: left; background: white;" |January, 2025
 
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! colspan="3" style="text-align: left; background: white;" |Affected products
 
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|-
 
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| style="width: 221px; text-align: left; background: white;" |Model
 
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| style="width: 448px; text-align: left; background: white;" |Affected order codes
 
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| style="width: 448px; text-align: left; background: white;" |Order code changes
 
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|-
 
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| style="text-align: left; background: white;" |FMB230
 
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| style="text-align: left; background: white;" |FMB230******* order codes
 
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| style="text-align: left; background: white;" |PCB's mechanical part changes
 
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! colspan="3" style="text-align: left; background: white;" |Change impact
 
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| style="width: 221px; text-align: left; background: white;" |Risk assessment
 
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| colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change.
 
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|-
 
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| style="text-align: left; background: white;" |Suggested implementation plan
 
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| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
 
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|-
 
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! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
 
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|-
 
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| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
 
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|-
 
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|}
 
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==2024.05.24: PCB changes==
 
−
We would like to inform you that starting from July, 2024, there will be changes in the PCB's modification of our FMB230 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
 
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{| class="wikitable"
 
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! colspan="3" style="text-align: left; background: white;" |Change description
 
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|-
 
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| style="text-align: left; background: white;" |Change type
 
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| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
 
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|-
 
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| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 
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| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
 
 
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
 
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
 
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
 
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
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#Added 1 positioning hole close to GNSS antenna.
 
#Added 1 positioning hole close to GNSS antenna.
 
#Positioning hole near LED's was removed.
 
#Positioning hole near LED's was removed.
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|-
 
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| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]                                                         
 
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| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
 
−
|-
 
−
| style="text-align: left; background: white;" |Change reasons
 
−
| colspan="2" style="text-align: left; background: white;" |
 
−
The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
 
 
|-
 
|-
 
| style="text-align: left; background: white;" | Product release date
 
| style="text-align: left; background: white;" | Product release date
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| colspan="2" style="text-align: left; background: white;" |2024 July
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| colspan="2" style="text-align: left; background: white;" |2024 June
 
|-
 
|-
 
|}
 
|}

Revision as of 09:07, 30 May 2024

Main Page > Advanced Trackers > FMB230 > FMB230 Product Change Notifications

Product change notifications (PCN) is the way of informing customers of upcoming changes related to Teltonika products. This includes outward appearance adjustments, hardware improvements, firmware changes, changes to package contents, etc. This page stores information regarding changes to the FMB230 tracking device. Below you will find a list of both upcoming and already implemented changes sorted from newest to oldest (top to bottom).

2024.05.24: PCB changes

We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMB110 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.

Change description
Change type Mechanical part changes
Detailed description The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
Old Version:
OLD front.png
OLD back.png
 New Version:
NEW front.png
NEW back.png
Change reasons
  1. Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
  2. Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
  3. Accelerometer LIS2DH12 was moved to top layer and closer to existing LIS3DH accelerometer.
  4. Positioning hole was moved from LTE to BLE antenna.
  5. Components from GNSS antenna feed point were moved away to comply with manufacturing requirements.
  6. Main fuse moved to TOP layer.
  7. Added 1 positioning hole close to GNSS antenna.
  8. Positioning hole near LED's was removed.
Product release date 2024 June
Affected products
Model Affected order codes Order code changes
FMB230 FMB230******* order codes New firmware version
Change impact
Risk assessment Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
Suggested implementation plan If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.

2024.05.13: Base firmware update

We would like to inform you about the base firmware update for FMB230 starting from June, 2024. New production firmware version will be 03.29.00.Rev.18

Change description
Change type Firmware update
Detailed description Key improvements from last production firmware are listed in errata: FMB230 firmware errata
Old version:
03.29.00.Rev.13 		New version:
03.29.00.Rev.18
Change reasons FMB230 base firmware version update
Product release date 2024 June
Affected products
Model Affected order codes Order code changes
FMB230 Order codes with base Firmware New firmware version
Change impact
Risk assessment Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
Suggested implementation plan If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.


2024.01.22: Modified battery placement within the casing

We would like to inform you that starting from January 2024, there will be a small change in the FMB230 devices casing.We have adjusted the battery placement and increased PCB guide height within casing. This modification was essential to enhance our manufacturing process.

Change description
Change type Optimizing robotic battery placement process within casing
Detailed description The modifications will not impact the place of the battery or PCB within the FMB230 device.
Old Version:
FMX - OLD.jpg
 New Version:
FMX - NEW.jpg
FMX - NEW 2.jpg
Change reasons
  1. Modified battery placement within the casing.
  2. PCB guide height increased for easier assembly.
  3. Improved manufacturing process.
Product release date January, 2024
Affected products
Model Affected order codes Order code changes
FMB230 FMB230 all codes Modified battery placement and PCB guide height within the casing.
Change impact
Risk assessment During transition period clients might receive devices with previous casing design. The transition period can last from January to February inclusive.
Suggested implementation plan No implementation plan is needed.
Acknowledgement of PCN receipt
If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.

2023.11.27: Modifications of PCB shape

We would like to inform you, that shape of the PCB (Printed Circuit Board) for the FMB110, FMB120, FMB130, and FMB230 devices will be altered as part of an upcoming factory update from November, 2023.

Change description
Change type Internal
Detailed description The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
Old Version:
51 TOP OLD.png
51 BOT OLD.png
 New Version:
64 TOP NEW.png
64 BOT NEW.png
Change reasons
  1. The cutout has been removed as it is intended only for devices with an external antenna.
  2. Replaced electrolytic capacitors with ceramic capacitors in order to increase manufacturing efficiency. The modifications made do not have any impact on the functionality of the devices.
Product release date November, 2023
Affected products
Model Affected order codes Order code changes
FMB230 FMB230 all codes
  1. PCB cutout intended for an external antenna has been removed.
  2. Replaced electrolytic capacitors with ceramic capacitors.
Change impact
Risk assessment No risk factors encountered with this change.
Suggested implementation plan Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
Acknowledgement of PCN receipt
If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.

2022.09.12: Base firmware update

We would like to inform you about the base firmware update for FMB230 starting from October 1st, 2022. New production firmware version will be 03.27.13.Rev.03

Change description
Change type Firmware update
Detailed description Key improvements from last production firmware are listed in errata: https://wiki.teltonika-gps.com/view/FMB230_firmware_errata
Old version:
FMB230 03.27.12.Rev.00 		New version:
FMB230 03.27.13.Rev.03
Change reasons FMB230 base firmware version update
Product release date 2022 October
Affected products
Model Affected order codes Order code changes
FMB230 FMB230******* order codes with base Firmware Update firmware
Change impact
Risk assessment Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
Suggested implementation plan If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
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