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FMC230 Product Change Notifications (view source)

Revision as of 14:18, 7 June 2024

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→‎2024.05.13: Base firmware update
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==2024 June: PCB changes==
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We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMC230 devices. These changes affect FMC125, FMC225, FMC130, FMC230 and FMC234 devices.
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Change description
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|-
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| style="text-align: left; background: white;" |Change type
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| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
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|-
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| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
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| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
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# U4100 changed to APM32F003F6U6
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# Changed SWD pinout
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# Added QR to BOT side
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# Icreased TestPoint diameter
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# Added TestPoint for reset pin(clearly visible)
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# Removed modem USB TestPoint(clearly visible)
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# Removed RF socket and cutout (Major change, clearly visible)
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# Remade Palette just like in FMB1X0 project
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# Discrete DOUT -> DOUT chip (clearly visible)
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# Changed fuse to a smaller footprint (clearly visible)
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|-
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| style="text-align: left; background: white;" |Old version:<br><br>
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[[File:C TOP -1.png|250px]]
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[[File:C BOT -1.png|250px]]<br>
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<br>
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| style="text-align: left; background: white;" |New version:<br>
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[[File:F TOP -3.png|250px]]<br>
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[[File:F BOT -3.png|250px]]
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|-
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| style="text-align: left; background: white;" |Change reasons
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| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
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|-
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| style="text-align: left; background: white;" | Product release date
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| colspan="2" style="text-align: left; background: white;" |2024 June
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|-
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|}
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Affected products
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|-
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| style="width: 221px; text-align: left; background: white;" |Model
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| style="width: 448px; text-align: left; background: white;" |Affected order codes
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| style="width: 448px; text-align: left; background: white;" |Order code changes
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|-
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| style="text-align: left; background: white;" |FMC230
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| style="text-align: left; background: white;" |FMC230******* order codes
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| style="text-align: left; background: white;" |PCB's mechanical part changes
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|-
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|}
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Change impact
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|-
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| style="width: 221px; text-align: left; background: white;" |Risk assessment
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| colspan="2" style="width: 908px; text-align: left; background: white;" | No risk factors encountered with this change.
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|-
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| style="text-align: left; background: white;" |Suggested implementation plan
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| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
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|-
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|}
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==2024.05.13: Base firmware update==
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We would like to inform you about the base firmware update for FMC230 starting from June, 2024. New production firmware version will be '''03.29.00.Rev.18'''
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Change description
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|-
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| style="text-align: left; background: white;" |Change type
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| colspan="2" style="text-align: left; background: white;" |Firmware update
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|-
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| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
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| colspan="2" style="width: 908px; text-align: left; background: white;" |Key improvements from last production firmware are listed in errata: [[FMC230 firmware errata]]
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|-
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| style="text-align: left; background: white;" |Old version: <br> 03.29.00.Rev.13
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| style="text-align: left; background: white;" |New version: <br> 03.29.00.Rev.18
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|-
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| style="text-align: left; background: white;" |Change reasons
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| colspan="2" style="text-align: left; background: white;" |FMC230 base firmware version update
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|-
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| style="text-align: left; background: white;" | Product release date
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| colspan="2" style="text-align: left; background: white;" |2024 June
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|-
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|}
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Affected products
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|-
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| style="width: 221px; text-align: left; background: white;" |Model
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| style="width: 448px; text-align: left; background: white;" |Affected order codes
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| style="width: 448px; text-align: left; background: white;" |Order code changes
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|-
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| style="text-align: left; background: white;" |FMC230
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| style="text-align: left; background: white;" |Order codes with base Firmware
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| style="text-align: left; background: white;" |New firmware version
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|-
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|}
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{| class="wikitable"
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! colspan="3" style="text-align: left; background: white;" |Change impact
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|-
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| style="width: 221px; text-align: left; background: white;" |Risk assessment
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| colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
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|-
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| style="text-align: left; background: white;" |Suggested implementation plan
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| colspan="2" style="text-align: left; background: white;" |If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
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|-
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|}
    
==2024.01.22: Modified battery placement within the casing==
 
==2024.01.22: Modified battery placement within the casing==
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We would like to inform you that starting from January 2024, there will be a small change in the FMC230 devices casing. We have adjusted the placement positioning of our batteries, making it slightly smaller and increased PCB guide height within the casing. This modification was essential to enhance our manufacturing process.
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We would like to inform you that starting from January 2024, there will be a small change in the FMC230 devices casing. We have adjusted the battery placement and increased PCB guide height within casing. This modification was essential to enhance our manufacturing process.
    
{| class="wikitable"
 
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| style="text-align: left; background: white;" |Change type
 
| style="text-align: left; background: white;" |Change type
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| colspan="2" style="text-align: left; background: white;" |Optimizing robotic battery placement process with casing
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| colspan="2" style="text-align: left; background: white;" |Optimizing robotic battery placement process within casing
 
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|-
 
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
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| colspan="2" style="width: 908px; text-align: left; background: white;" |The Modifications will not impact the place of the battery or PCB within the FMC230 device.
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| colspan="2" style="width: 908px; text-align: left; background: white;" |The modifications will not impact the place of the battery or PCB within the FMC230 device.
 
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| style="text-align: left; background: white;" |Old Version: [[File:FMX - OLD.jpg|center|250px]]                                                       
 
| style="text-align: left; background: white;" |Old Version: [[File:FMX - OLD.jpg|center|250px]]                                                       
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