Changes

Line 3: Line 3:  
}}
 
}}
 
==2024.05.24: PCB changes==
 
==2024.05.24: PCB changes==
We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMB130 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
+
We would like to inform you that starting from May, 2024, there will be changes in the PCB's modification of our FMB130 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
 
{| class="wikitable"
 
{| class="wikitable"
 
|+
 
|+
Line 13: Line 13:  
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 
| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
 
| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
|-
  −
| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]                                                         
  −
| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
  −
|-
  −
| style="text-align: left; background: white;" |Change reasons
  −
| colspan="2" style="text-align: left; background: white;" |
   
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
 
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
 
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
 
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
Line 27: Line 21:  
#Added 1 positioning hole close to GNSS antenna.
 
#Added 1 positioning hole close to GNSS antenna.
 
#Positioning hole near LED's was removed.
 
#Positioning hole near LED's was removed.
 +
|-
 +
| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]                                                         
 +
| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
 +
|-
 +
| style="text-align: left; background: white;" |Change reasons
 +
| colspan="2" style="text-align: left; background: white;" |
 +
The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
 
|-
 
|-
 
| style="text-align: left; background: white;" | Product release date
 
| style="text-align: left; background: white;" | Product release date