FMC130 Product Change Notifications: Difference between revisions
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==2025.07.10: Base firmware update== | |||
We would like to inform you about the base firmware update for FMC130 starting from July, 2025. New production firmware version will be '''04.00.00.Rev.13''' | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change description | |||
|- | |||
| style="text-align: left; background: white;" |Change type | |||
| colspan="2" style="text-align: left; background: white;" |Firmware update | |||
|- | |||
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |Key improvements from last production firmware are listed in errata: [[FMC130 firmware errata]] | |||
|- | |||
| style="text-align: left; background: white;" |Old version: <br> 03.29.00.Rev.18 | |||
| style="text-align: left; background: white;" |New version: <br> 04.00.00.Rev.13 | |||
|- | |||
| style="text-align: left; background: white;" |Change reasons | |||
| colspan="2" style="text-align: left; background: white;" |FMC130 base firmware version update | |||
|- | |||
| style="text-align: left; background: white;" | Product release date | |||
| colspan="2" style="text-align: left; background: white;" |2025 July | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Affected products | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Model | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes | |||
| style="width: 448px; text-align: left; background: white;" |Order code changes | |||
|- | |||
| style="text-align: left; background: white;" |FMC130 | |||
| style="text-align: left; background: white;" |All order codes with base firmware | |||
| style="text-align: left; background: white;" |New firmware version | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change impact | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Risk assessment | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" | | |||
* Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. | |||
* During the transition period clients might receive devices with previous firmware version used in manufacture. | |||
* It is not possible to downgrade devices from '''04.00.00''' to older version special or standard firmware. | |||
|- | |||
| style="text-align: left; background: white;" |Suggested implementation plan | |||
| colspan="2" style="text-align: left; background: white;" |If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager. | |||
|- | |||
|} | |||
==2025 April: PCB changes== | |||
We would like to inform you that starting from April, 2025, there will be changes in the PCB's modification of our FMC130 devices. These changes affect FMC125, FMC225, FMC130, FMC230 and FMC234 devices. | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change description | |||
|- | |||
| style="text-align: left; background: white;" |Change type | |||
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes | |||
|- | |||
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB: | |||
# Removed redundant capacitors in the power net of the device. | |||
# Removed redundant zenner diodes. | |||
|- | |||
| style="text-align: left; background: white;" |Old version:<br><br> | |||
[[File:PCB1top.png|250px]] | |||
[[File:PCB2bot.png|250px]]<br> | |||
<br> | |||
| style="text-align: left; background: white;" |New version:<br> | |||
[[File:PCB3top.png|250px]]<br> | |||
[[File:PCB4bot.png|250px]] | |||
|- | |||
| style="text-align: left; background: white;" |Change reasons | |||
| colspan="2" style="text-align: left; background: white;" |The PCB assembly was changed to improve the efficiency of the power delivery of the device | |||
|- | |||
| style="text-align: left; background: white;" | Product release date | |||
| colspan="2" style="text-align: left; background: white;" | April, 2025 | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Affected products | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Model | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes | |||
| style="width: 448px; text-align: left; background: white;" |Order code changes | |||
|- | |||
| style="text-align: left; background: white;" |FMC130 | |||
| style="text-align: left; background: white;" |FMC130******* order codes | |||
| style="text-align: left; background: white;" |PCB's mechanical part changes | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change impact | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Risk assessment | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" | No risk factors encountered with this change. | |||
|- | |||
| style="text-align: left; background: white;" |Suggested implementation plan | |||
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process. | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt | |||
|- | |||
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above. | |||
|- | |||
|} | |||
==2024.09.10: PCB changes== | |||
We would like to inform you that starting from December, 2024, there will be changes in the PCB's modification of our FMC130 devices. These changes affect FMC125, FMC225, FMC130, FMC230 and FMC234 devices. | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change description | |||
|- | |||
| style="text-align: left; background: white;" |Change type | |||
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes | |||
|- | |||
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB: | |||
# The DOUT is derived from discrete components. | |||
# No longer utilizes a dedicated part for the DOUT functionality. | |||
# Features simple overvoltage protection for the RS485 interface. | |||
# The microcontroller unit (MCU) has been upgraded from a Geehy MCU to an STM MCU. | |||
|- | |||
| style="text-align: left; background: white;" |Old version:<br><br> | |||
[[File:PCB1.png|250px]] | |||
[[File:PCB2.png|250px]]<br> | |||
<br> | |||
| style="text-align: left; background: white;" |New version:<br> | |||
[[File:PCB3.png|250px]]<br> | |||
[[File:PCB4.png|250px]] | |||
|- | |||
| style="text-align: left; background: white;" |Change reasons | |||
| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient. | |||
|- | |||
| style="text-align: left; background: white;" | Product release date | |||
| colspan="2" style="text-align: left; background: white;" | December, 2024 | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Affected products | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Model | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes | |||
| style="width: 448px; text-align: left; background: white;" |Order code changes | |||
|- | |||
| style="text-align: left; background: white;" |FMC130 | |||
| style="text-align: left; background: white;" |FMC130******* order codes | |||
| style="text-align: left; background: white;" |PCB's mechanical part changes | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change impact | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Risk assessment | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" | No risk factors encountered with this change. | |||
|- | |||
| style="text-align: left; background: white;" |Suggested implementation plan | |||
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process. | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt | |||
|- | |||
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above. | |||
|- | |||
|} | |||
==2024 June: PCB changes== | |||
We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMC130 devices. These changes affect FMC125, FMC225, FMC130, FMC230 and FMC234 devices. | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change description | |||
|- | |||
| style="text-align: left; background: white;" |Change type | |||
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes | |||
|- | |||
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB: | |||
# U4100 changed to APM32F003F6U6 | |||
# Changed SWD pinout | |||
# Added QR to BOT side | |||
# Icreased TestPoint diameter | |||
# Added TestPoint for reset pin(clearly visible) | |||
# Removed modem USB TestPoint(clearly visible) | |||
# Removed RF socket and cutout (Major change, clearly visible) | |||
# Remade Palette just like in FMB1X0 project | |||
# Discrete DOUT -> DOUT chip (clearly visible) | |||
# Changed fuse to a smaller footprint (clearly visible) | |||
|- | |||
| style="text-align: left; background: white;" |Old version:<br><br> | |||
[[File:C TOP -1.png|250px]] | |||
[[File:C BOT -1.png|250px]]<br> | |||
<br> | |||
| style="text-align: left; background: white;" |New version:<br> | |||
[[File:F TOP -3.png|250px]]<br> | |||
[[File:F BOT -3.png|250px]] | |||
|- | |||
| style="text-align: left; background: white;" |Change reasons | |||
| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient. | |||
|- | |||
| style="text-align: left; background: white;" | Product release date | |||
| colspan="2" style="text-align: left; background: white;" |2024 June | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Affected products | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Model | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes | |||
| style="width: 448px; text-align: left; background: white;" |Order code changes | |||
|- | |||
| style="text-align: left; background: white;" |FMC130 | |||
| style="text-align: left; background: white;" |FMC130******* order codes | |||
| style="text-align: left; background: white;" |PCB's mechanical part changes | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change impact | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Risk assessment | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" | No risk factors encountered with this change. | |||
|- | |||
| style="text-align: left; background: white;" |Suggested implementation plan | |||
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process. | |||
|- | |||
|} | |||
==2024.05.13: Base firmware update== | ==2024.05.13: Base firmware update== | ||
We would like to inform you about the base firmware update for FMC130 starting from June, 2024. New production firmware version will be '''03.29.00.Rev.18''' | We would like to inform you about the base firmware update for FMC130 starting from June, 2024. New production firmware version will be '''03.29.00.Rev.18''' | ||
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|- | |- | ||
| style="text-align: left; background: white;" |FMC130 | | style="text-align: left; background: white;" |FMC130 | ||
| style="text-align: left; background: white;" | | | style="text-align: left; background: white;" | | ||
* FMC1304O***** with 03.29.00.Rev.13 firmware | |||
* FMC130KY***** with 03.29.00.Rev.13 firmware | |||
* FMC130LK***** with 03.29.00.Rev.13 firmware | |||
* FMC130NQ***** with 03.29.00.Rev.13 firmware | |||
* FMC130QL***** with 03.29.00.Rev.13 firmware | |||
| style="text-align: left; background: white;" |New firmware version | | style="text-align: left; background: white;" |New firmware version | ||
|- | |- | ||
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|- | |- | ||
|} | |} | ||
==2024.01.05: GNSS antenna changes== | ==2024.01.05: GNSS antenna changes== | ||
We would like to inform you that starting from February 2024, there will be a change in the manufacturing process of our FMC130 devices. We will be transitioning to utilize Surface Mount Device (SMD) manufactured GNSS antennas, which will replace the existing Dual-In-line Package (DIP) technique. | We would like to inform you that starting from February 2024, there will be a change in the manufacturing process of our FMC130 devices. We will be transitioning to utilize Surface Mount Device (SMD) manufactured GNSS antennas, which will replace the existing Dual-In-line Package (DIP) technique. | ||