Changes

#The top layer remains unchanged.

#The top layer remains unchanged.

|-

|-

| style="text-align: left; background: white;" |Old Version: <br>  [[File:png.|center|250px]] [[File:png.|center|250px]]

| style="text-align: left; background: white;" |Old Version: <br>  [[File:PCBOLD_FMM130_2024.10.04_png.|center|250px]] [[File:PCBOLD1_FMM130_2024.10.04_png.|center|250px]]

| style="text-align: left; background: white;" |New Version: <br>  [[File:png.|250px]] [[File:png.|center|250px]]

| style="text-align: left; background: white;" |New Version: <br>  [[File:PCBNEW_FMM130_2024.10.04_png.|center|250px]] [[File:PCBNEW1_FMM130_2024.10.04_png.|center|250px]]

|-

|-

| style="text-align: left; background: white;" |Change reasons

| style="text-align: left; background: white;" |Change reasons

| colspan="2" style="text-align: left; background: white;" |

| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.  

#The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.  

|-

|-

| style="text-align: left; background: white;" | Product release date

| style="text-align: left; background: white;" | Product release date