FMM230 Product Change Notifications: Difference between revisions
no edit summary
No edit summary |
|||
| Line 2: | Line 2: | ||
| product_name = FMM230 tracking device | | product_name = FMM230 tracking device | ||
}} | }} | ||
==2024.10.03: PCB changes== | |||
We would like to inform you that starting from January, 2025, there will be changes in the PCB's modification of our FMM230 devices. These changes affect FMM130, FMM230 and FMM125 devices. | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change description | |||
|- | |||
| style="text-align: left; background: white;" |Change type | |||
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes | |||
|- | |||
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB: | |||
#Replaced the LIS3DH accelerometer on the bottom layer with an LIS2DH12 on a neighbouring footprint. Additionally, the accompanying capacitors and resistors were replaced. | |||
#The top layer remains unchanged. | |||
|- | |||
| style="text-align: left; background: white;" |Old Version: <br> [[File:PCBOLD_FMM130_2024.10.04.png|center|250px]] [[File:PCBOLD1_FMM130_2024.10.04.png|center|250px]] | |||
| style="text-align: left; background: white;" |New Version: <br> [[File:PCBNEW_FMM130_2024.10.04.png|center|250px]] [[File:PCBNEW1_FMM130_2024.10.04.png|center|250px]] | |||
|- | |||
| style="text-align: left; background: white;" |Change reasons | |||
| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient. | |||
|- | |||
| style="text-align: left; background: white;" | Product release date | |||
| colspan="2" style="text-align: left; background: white;" |January, 2025 | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Affected products | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Model | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes: '''FMM230'''******* order codes | |||
| style="width: 448px; text-align: left; background: white;" |Affected order codes: '''FMM230'''******* order codes | |||
|- | |||
| style="text-align: left; background: white;" |'''FMM130''' | |||
| style="text-align: left; background: white;" |PCB's mechanical part changes | |||
| style="text-align: left; background: white;" |PCB's mechanical part changes | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="text-align: left; background: white;" |Change impact | |||
|- | |||
| style="width: 221px; text-align: left; background: white;" |Risk assessment | |||
| colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change. | |||
|- | |||
| style="text-align: left; background: white;" |Suggested implementation plan | |||
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process. | |||
|- | |||
|} | |||
{| class="wikitable" | |||
|+ | |||
! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt | |||
|- | |||
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above. | |||
|- | |||
|} | |||
==2024.07.29: PCB changes== | ==2024.07.29: PCB changes== | ||