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==2024.10.03: PCB changes==
We would like to inform you that starting from January, 2025, there will be changes in the PCB's modification of our FMB130 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change description
|-
| style="text-align: left; background: white;" |Change type
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
|-
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
#Replaced the LIS3DH accelerometer on the top layer with an LIS2DH12 on a neighbouring footprint. Additionally, the accompanying capacitors and resistors were replaced.
#The bottom layer remains unchanged.
|-
| style="text-align: left; background: white;" |Old Version: <br> [[File:PCBOLD3_FMM130_2024.10.04.png|center|250px]] [[File:PCBOLD4_FMM130_2024.10.04.png|center|250px]]
| style="text-align: left; background: white;" |New Version: <br> [[File:PCBNEW3_FMM130_2024.10.04.png|center|250px]] [[File:PCBNEW4_FMM130_2024.10.04.png|center|250px]]
|-
| style="text-align: left; background: white;" |Change reasons
| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
|-
| style="text-align: left; background: white;" | Product release date
| colspan="2" style="text-align: left; background: white;" |January, 2025
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Affected products
|-
| style="width: 221px; text-align: left; background: white;" |Model
| style="width: 448px; text-align: left; background: white;" |Affected order codes
| style="width: 448px; text-align: left; background: white;" |Order code changes
|-
| style="text-align: left; background: white;" |FMB130
| style="text-align: left; background: white;" |FMB130******* order codes
| style="text-align: left; background: white;" |PCB's mechanical part changes
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change impact
|-
| style="width: 221px; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 908px; text-align: left; background: white;" |No risk factors encountered with this change.
|-
| style="text-align: left; background: white;" |Suggested implementation plan
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
|-
|}
{| class="wikitable"
|+
! colspan="3" style="width: 1141px; text-align: left; background: white;" |Acknowledgement of PCN receipt
|-
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification – Teltonika may accept that this change has tactically accepted and can implement the change as indicated above.
|-
|}
==2024.05.24: PCB changes==
==2024.05.24: PCB changes==
