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FMB640 Product Change Notifications (view source)
Revision as of 10:50, 16 August 2021
, 10:50, 16 August 2021no edit summary
| product_name = FMB640 tracking device
| product_name = FMB640 tracking device
}}
}}
==2021.08.16: SMA soldering changes==
We would like to inform you that Antenna connectors (SMA SMD type) in FMB640 devices will be soldered from both sides of PCB starting from mid-August 2021.
{| class="wikitable" style="width:100%;"
|+
! colspan="3" style="text-align: left; background: white;" |Change description
|-
| style="text-align: left; background: white;" |Change type
| colspan="2" style="text-align: left; background: white;" |Internal
|-
| rowspan="2" style="width: 20%; text-align: left; background: white;" |Detailed description
|-
| style="width: 40%; text-align: left; background: white;" |Old version: [[File:Before solder.jpg|center|400 x 400px]]
| style="width: 40%; text-align: left; background: white;" |New version: [[File:After solder.jpg|center|400 x 400px]]
|-
| style="text-align: left; background: white;" |Change reasons/Description
| colspan="2" style="text-align: left; background: white;" |In order to increase the structural rigidity and unify the manufacturing process of Teltonika IoT Group devices, SMA connector will be soldered on the top side of PCB (same as before) and on the bottom side of PCB (performed additionally).
|-
| style="text-align: left; background: white;" |Product release date
| colspan="2" style="text-align: left; background: white;" |Second half of August 2021
|-
|}
{| class="wikitable" style="width:100%;"
|+
! colspan="3" style="text-align: left; background: white;" |Affected products
|-
| style="width: 20%; text-align: left; background: white;" |Model
| style="width: 40%; text-align: left; background: white;" |Affected order codes
| style="width: 40%; text-align: left; background: white;" |Order code changes
|-
| style="text-align: left; background: white;" |FMB640
| style="text-align: left; background: white;" |FMB640*******
| style="text-align: left; background: white;" |SMA soldering changes
|-
|}
{| class="wikitable" style="width:100%;"
|+
! colspan="3" style="text-align: left; background: white;" |Change impact
|-
| style="width: 20%; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 80%; text-align: left; background: white;" |Due to THT assembly process, some devices might have an excess amount of soldering on the SMA connector. <br> This does not affect GSM/GNSS antenna characteristics and does not interfere with device case assembly, therefore, device functionality remains unchanged.
[[File:Solder on top.jpg|center|400 x 400px]]
|-
| style="text-align: left; background: white;" |Suggested implementation plan
| colspan="2" style="text-align: left; background: white;" |No implementation plan needed
|-
|}
{| class="wikitable" style="width:100%;"
|+
! colspan="3" style="width: 100%; text-align: left; background: white;" |Acknowledgement of PCN receipt
|-
| colspan="3" style="text-align: left; background: white;" |If no feedback is received within two weeks after the issue date of this notification - Teltonika may accept that this change has been tacitly accepted and can implement the change as indicated above
|-
|}
==2021.08.03: Upgraded casing==
==2021.08.03: Upgraded casing==
