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| style="width: 20%; text-align: left; background: white;" |Risk assessment
 
| style="width: 20%; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 80%; text-align: left; background: white;" |Due to THT assembly process, some devices might have an excess amount of soldering on the SMA connector. <br> This does not affect GSM/GNSS antenna characteristics and does not interfere with device case assembly, therefore, device functionality remains unchanged.
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| colspan="2" style="width: 80%; text-align: left; background: white;" |Due to THT assembly process, some devices might have an excess amount of soldering on the SMA connector. <br> This does not affect GSM/GNSS antenna characteristics and does not interfere with device case assembly, therefore, device functionality remains unchanged. During the transition period clients might receive devices with previous Firmware version used in manufacture.
 
[[File:Solder on top.jpg|center|400 x 400px]]
 
[[File:Solder on top.jpg|center|400 x 400px]]
 
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