Changes

no edit summary
Line 48: Line 48:  
|-
 
|-
 
| style="width: 20%; text-align: left; background: white;" |Risk assessment
 
| style="width: 20%; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 80%; text-align: left; background: white;" |Due to THT assembly process, some devices might have an excess amount of soldering on the SMA connector. <br> This does not affect GSM/GNSS antenna characteristics and does not interfere with device case assembly, therefore, device functionality remains unchanged. During the transition period clients might receive devices with previous Firmware version used in manufacture.
+
| colspan="2" style="width: 80%; text-align: left; background: white;" |Due to THT assembly process, some devices might have an excess amount of soldering on the SMA connector. <br> This does not affect GSM/GNSS antenna characteristics and does not interfere with device case assembly, therefore, device functionality remains unchanged.  
 
[[File:Solder on top.jpg|center|400 x 400px]]
 
[[File:Solder on top.jpg|center|400 x 400px]]
 
|-
 
|-
Line 167: Line 167:  
|-
 
|-
 
| style="width: 221px; text-align: left; background: white;" |Risk assessment
 
| style="width: 221px; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically
+
| colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
 
|-
 
|-
 
| style="text-align: left; background: white;" |Suggested implementation plan
 
| style="text-align: left; background: white;" |Suggested implementation plan