Changes

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| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of the manufacturing process, transition from Dual-In-line Package (DIP) to Surface Mount Device (SMD) process.
 
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of the manufacturing process, transition from Dual-In-line Package (DIP) to Surface Mount Device (SMD) process.
 
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|-
| style="text-align: left; background: white;" |Old version: <br> Dual-In-Line Package (DIP) manufactured antennas [[File:GNSS antenna Dual-In-Line Package (DIP) v1.png|center]]
+
| style="text-align: left; background: white;" |Old version: <br> Dual-In-Line Package (DIP) manufactured antennas [[File:GNSS antenna Dual-In-Line Package (DIP) v1.png|center]]<br>
 +
Antenna size: 25x25x4 mm
 +
Center frequency: 1575.42 MHz, 1602 MHz
 +
VSWR: <1.1
 +
Average Gain: -2.6 dB
 +
Return loss: <-25 dB
 
| style="text-align: left; background: white;" |New version: <br> Surface Mount Device (SMD) manufactured antennas [[File:GNSS antenna DSurface Mount Device (SMD) v1.png|center]]
 
| style="text-align: left; background: white;" |New version: <br> Surface Mount Device (SMD) manufactured antennas [[File:GNSS antenna DSurface Mount Device (SMD) v1.png|center]]
 
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