| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of the manufacturing process, transition from Dual-In-line Package (DIP) to Surface Mount Device (SMD) process. | | colspan="2" style="width: 908px; text-align: left; background: white;" |Change of the manufacturing process, transition from Dual-In-line Package (DIP) to Surface Mount Device (SMD) process. |