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==2024.05.24: PCB changes==
We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMB110 devices. These changes affect FMB110, FMB120, FMB130 and FMB230 devices.
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change description
|-
| style="text-align: left; background: white;" |Change type
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
|-
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
|-
| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]
| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
|-
| style="text-align: left; background: white;" |Change reasons
| colspan="2" style="text-align: left; background: white;" |
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
#Accelerometer LIS2DH12 was moved to top layer and closer to existing LIS3DH accelerometer.
#Positioning hole was moved from LTE to BLE antenna.
#Components from GNSS antenna feed point were moved away to comply with manufacturing requirements.
#Main fuse moved to TOP layer.
#Added 1 positioning hole close to GNSS antenna.
#Positioning hole near LED's was removed.
|-
| style="text-align: left; background: white;" | Product release date
| colspan="2" style="text-align: left; background: white;" |2024 June
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Affected products
|-
| style="width: 221px; text-align: left; background: white;" |Model
| style="width: 448px; text-align: left; background: white;" |Affected order codes
| style="width: 448px; text-align: left; background: white;" |Order code changes
|-
| style="text-align: left; background: white;" |FMB230
| style="text-align: left; background: white;" |FMB230******* order codes
| style="text-align: left; background: white;" |New firmware version
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change impact
|-
| style="width: 221px; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 908px; text-align: left; background: white;" |Client's special firmware versions or order codes with special firmware will not be updated to latest base firmware automatically. During the transition period clients might receive devices with previous Firmware version used in manufacture.
|-
| style="text-align: left; background: white;" |Suggested implementation plan
| colspan="2" style="text-align: left; background: white;" |If you are using special firmware version and would like an upgrade to new features of latest base firmware, please contact your Teltonika sales manager.
|-
|}
==2024.05.13: Base firmware update==
==2024.05.13: Base firmware update==
