2,538
edits
Changes
→2024.05.13: Base firmware update
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==2024 June: PCB changes==
We would like to inform you that starting from June, 2024, there will be changes in the PCB's modification of our FMC230 devices. These changes affect FMC125, FMC225, FMC130, FMC230 and FMC234 devices.
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change description
|-
| style="text-align: left; background: white;" |Change type
| colspan="2" style="text-align: left; background: white;" |Mechanical part changes
|-
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| colspan="2" style="width: 908px; text-align: left; background: white;" |Change of mechanical components within PCB:
# U4100 changed to APM32F003F6U6
# Changed SWD pinout
# Added QR to BOT side
# Icreased TestPoint diameter
# Added TestPoint for reset pin(clearly visible)
# Removed modem USB TestPoint(clearly visible)
# Removed RF socket and cutout (Major change, clearly visible)
# Remade Palette just like in FMB1X0 project
# Discrete DOUT -> DOUT chip (clearly visible)
# Changed fuse to a smaller footprint (clearly visible)
|-
| style="text-align: left; background: white;" |Old version:<br><br>
[[File:C TOP -1.png|250px]]
[[File:C BOT -1.png|250px]]<br>
<br>
| style="text-align: left; background: white;" |New version:<br>
[[File:F TOP -3.png|250px]]<br>
[[File:F BOT -3.png|250px]]
|-
| style="text-align: left; background: white;" |Change reasons
| colspan="2" style="text-align: left; background: white;" |The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
|-
| style="text-align: left; background: white;" | Product release date
| colspan="2" style="text-align: left; background: white;" |2024 June
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Affected products
|-
| style="width: 221px; text-align: left; background: white;" |Model
| style="width: 448px; text-align: left; background: white;" |Affected order codes
| style="width: 448px; text-align: left; background: white;" |Order code changes
|-
| style="text-align: left; background: white;" |FMC230
| style="text-align: left; background: white;" |FMC230******* order codes
| style="text-align: left; background: white;" |PCB's mechanical part changes
|-
|}
{| class="wikitable"
|+
! colspan="3" style="text-align: left; background: white;" |Change impact
|-
| style="width: 221px; text-align: left; background: white;" |Risk assessment
| colspan="2" style="width: 908px; text-align: left; background: white;" | No risk factors encountered with this change.
|-
| style="text-align: left; background: white;" |Suggested implementation plan
| colspan="2" style="text-align: left; background: white;" |Due to changes in device appearance we strongly recommend to contact your customs agent with our change log information, to avoid any unexpected delays in customs clearance process.
|-
|}
==2024.05.13: Base firmware update==
==2024.05.13: Base firmware update==
|-
|-
|}
|}
==2024.01.22: Modified battery placement within the casing==
==2024.01.22: Modified battery placement within the casing==
