5,131
edits
Changes
→2024.05.24: PCB changes
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
| colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
#Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
#Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
#Added 1 positioning hole close to GNSS antenna.
#Added 1 positioning hole close to GNSS antenna.
#Positioning hole near LED's was removed.
#Positioning hole near LED's was removed.
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| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]
| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
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| style="text-align: left; background: white;" |Change reasons
| colspan="2" style="text-align: left; background: white;" |
The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
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| style="text-align: left; background: white;" | Product release date
| style="text-align: left; background: white;" | Product release date
