FMB230 Product Change Notifications: Difference between revisions

FMB230 Product Change Notifications (view source)

Revision as of 13:55, 17 June 2024

123 bytes added , 17 June

→‎2024.05.24: PCB changes

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 | rowspan="2" style="width: 221px; text-align: left; background: white;" |Detailed description
 | colspan="2" style="width: 908px; text-align: left; background: white;" |The PCB shape has been modified for the following devices: FMB110, FMB120, FMB130, and FMB230. These changes will be implemented during the upcoming factory update.
-|-
-| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]
-| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
-|-
-| style="text-align: left; background: white;" |Change reasons
-| colspan="2" style="text-align: left; background: white;" |
 #Components which were too close (less than 1.5mm) to the testpoints were moved away to comply with this requirement.
 #Overvoltage protection mosfet changed to 2x mosfets with smaller footprint.
@@ Line 30: / Line 24: @@
 #Added 1 positioning hole close to GNSS antenna.
 #Positioning hole near LED's was removed.
+|-
+| style="text-align: left; background: white;" |Old Version: [[File:OLD front.png|center|250px]] [[File:OLD back.png|center|250px]]
+| style="text-align: left; background: white;" |New Version: [[File:NEW front.png|center|250px]] [[File:NEW back.png|center|250px]]
+|-
+| style="text-align: left; background: white;" |Change reasons
+| colspan="2" style="text-align: left; background: white;" |
+The PCB shape in the afore-mentioned devices is updated to streamline the manufacturing process, making it more efficient.
 |-
 | style="text-align: left; background: white;" | Product release date